Junping Li

City:

Shanghai

Country:

China

Published Applications:

Last publication date:

2022-03-03

Top Assignees for applications by Junping Li

The entities that hold a legal rights for patent applications filed by inventor Li Junping:

Junping Li from Shanghai, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

Data link layer device and packet encapsulation method thereof

Ring bus and credit allocation method

InventorID:

2810423 ⎘