Nuertingen
Germany
94
2026-06-04
The entities that hold a legal rights for patent applications filed by inventor Weber Heribert:
Heribert Weber from Nuertingen, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
METHOD FOR PRODUCING A MAGNETIC SENSOR
#2 | 2026-02-12METHOD FOR MAKING A HOLLOW STRUCTURE, AND MICROMECHANICAL SENSOR HAVING SUCH A HOLLOW STRUCTURE
#3 | 2025-12-25MICROMECHANICAL PRESSURE SENSOR HAVING AT LEAST TWO MEMBRANES FOR DETERMINING A PRESSURE VALUE, AND CORRESPONDING METHOD
#4 | 2024-12-05MICROMECHANICAL COMPONENT FOR A SENSOR DEVICE OR MICROPHONE DEVICE
#5 | 2024-11-21MICROMECHANICAL PRESSURE SENSOR ELEMENT
#6 | 2024-11-21MICROMECHANICAL COMPONENT
#7 | 2024-10-31METHOD FOR PRODUCING A PARTICLE PROTECTION ELEMENT, IN PARTICULAR A PARTICLE FILTER, FOR A MEMBRANE OF A PRESSURE SENSOR, PARTICLE PROTECTION ELEMENT, METHOD FOR PRODUCING A PRESSURE SENSOR, AND PRESSURE SENSOR
#8 | 2024-08-29METHOD FOR FORMING A LAYER STRUCTURE SURROUNDING AT LEAST ONE RECESS, AND DEVICE WITH A LAYER STRUCTURE
#9 | 2023-12-28MICROMECHANICAL COMPONENT FOR A SENSOR AND/OR MICROPHONE DEVICE
#10 | 2023-11-23SENSOR DEVICE AND METHOD FOR DETECTING THE INTERNAL PRESSURE AND/OR A CHANGE IN THE INTERNAL PRESSURE IN A GAS-TIGHT INTERNAL VOLUME OF A HOUSING COMPONENT
#11 | 2023-11-09PRODUCTION METHOD FOR A MICROMECHANICAL COMPONENT FOR A SENSOR DEVICE OR MICROPHONE DEVICE
#12 | 2023-10-26METHOD FOR MANUFACTURING A MICROMECHANICAL SENSOR
#13 | 2023-09-28MICROMECHANICAL COMPONENT
#14 | 2023-08-03MICROMECHANICAL COMPONENT AND MANUFACTURING METHOD FOR A MICROMECHANICAL COMPONENT FOR A SENSOR OR MICROPHONE DEVICE
#15 | 2022-12-15Micromechanical component for a sensor device or microphone device
#16 | 2022-12-08Micromechanical component for a sensor device having a capacitor sealing structure
#17 | 2022-03-24MEMS capacitive sensor including improved contact separation
#18 | 2022-03-17Production method for a micromechanical component
#19 | 2022-01-06Micromechanical component for a capacitive pressure sensor device
#20 | 2022-01-06Method for sealing entries in a MEMS element
#21 | 2021-12-23Micromechanical component and method for manufacturing a micromechanical component
#22 | 2021-11-18MICROMECHANICAL COMPONENT FOR A SENSOR OR MICROPHONE DEVICE
#23 | 2021-07-15Micromechanical component for a sensor device or microphone device
#24 | 2021-07-15Micromechanical pressure sensor device including a diaphragm system and corresponding manufacturing method
#25 | 2020-06-25Micromechanical component for a capacitive pressure sensor device
#26 | 2020-05-07Bonding pad layer system, gas sensor and method for manufacturing a gas sensor
#27 | 2017-06-15METHOD FOR THE MICRO-STRUCTURED APPLICATION OF A FLUID OR PASTE ONTO A SURFACE
#28 | 2015-06-04Method for manufacturing a micromechanical component
#29 | 2015-06-04Dispersion for the metallization of contactings
#30 | 2015-05-21COMPONENT HAVING A VIA AND METHOD FOR MANUFACTURING IT
#31 | 2015-03-05Micromechanical component for a capacitive sensor device, and manufacturing method for a micromechanical component for a capacitive sensor device
#32 | 2014-12-25Method for producing a metal structure in a semiconductor substrate
#33 | 2014-12-25ASIC element including a via
#34 | 2014-12-25Component in the form of a wafer level package and method for manufacturing same
#35 | 2014-12-25COMPONENT INCLUDING MEANS FOR REDUCING ASSEMBLY-RELATED MECHANICAL STRESSES AND METHODS FOR MANUFACTURING SAME
#36 | 2014-05-01Hybrid integrated component
#37 | 2014-05-01Micromechanical component
#38 | 2014-04-24Method for manufacturing a cap for a MEMS component, and hybrid integrated component having such a cap
#39 | 2014-04-03Magnetically drivable micromirror
#40 | 2014-04-03Hybrid integrated pressure sensor component
#41 | 2013-12-26Component having through-hole plating, and method for its production
#42 | 2013-12-19Hybrid integrated component and method for the manufacture thereof
#43 | 2013-11-14Hybridly integrated component and method for the production thereof
#44 | 2013-11-14Hybrid integrated component and method for the manufacture thereof
#45 | 2013-10-31Method for manufacturing a hybrid integrated component
#46 | 2013-08-15COMPONENT HAVING A THROUGH-CONNECTION
#47 | 2013-06-27Method for bonding two silicon substrates, and a correspondeing system of two silicon substrates
#48 | 2013-06-13Component having a via and method for manufacturing it
#49 | 2012-10-04Method for creating monocrystalline piezoresistors
#50 | 2012-03-15Method for constructing an electrical circuit, and electrical circuit
#51 | 2012-03-01Method for producing a micromechanical component having a trench structure for backside contact
#52 | 2012-02-23Micromechanical component and method for producing a micromechanical component
#53 | 2012-02-16Method for Producing an Electrical Circuit and Electrical Circuit
#54 | 2012-02-16Method for filling cavities in wafers, correspondingly filled blind hole and wafer having correspondingly filled insulation trenches
#55 | 2012-02-09Sensor module
#56 | 2011-10-27Sensor system, method for operating a sensor system, and method for manufacturing a sensor system
#57 | 2011-07-14Method for providing and connecting two contact areas of a semiconductor component or a substrate, and a substrate having two such connected contact areas
#58 | 2011-07-14Method for forming trenches in a semiconductor component
#59 | 2011-06-23Micromechanical component having an inclined structure and corresponding manufacturing method
#60 | 2011-01-20Device made of single-crystal silicon
#61 | 2010-12-09MICROMECHANICAL ACCELERATION SENSOR AND METHOD FOR MANUFACTURING AN ACCELERATION SENSOR
#62 | 2010-11-16Micromechanical component and corresponding production method
#63 | 2010-10-14Method for attaching a first carrier device to a second carrier device and micromechanical components
#64 | 2010-07-01Micromechanical component and corresponding production method
#65 | 2010-06-03Method for producing a micromechanical component having a trench structure for backside contact
#66 | 2010-04-15Method for producing a micromechanical component having a filler layer and a masking layer
#67 | 2010-02-04Method for Manufacturing a Diaphragm on a Semiconductor Substrate and Micromechanical Component Having Such a Diaphragm
#68 | 2009-08-20Micromechanical diaphragm sensor having a double diaphragm
#69 | 2009-06-25Method for producing a micromechanical component and mircomechanical component
#70 | 2009-04-23Capacitive acceleration sensor having a movable mass and a spring element
#71 | 2009-03-26Micromechanical component and method for producing a micromechanical component
#72 | 2009-01-08Device made of single-crystal silicon
#73 | 2008-11-20Method for producing a semiconductor component and a semiconductor component produced according to the method
#74 | 2008-09-02Method for producing optically transparent regions in a silicon substrate
#75 | 2007-11-27Method for producing a semiconductor component having a movable mass in particular, and semiconductor component produced according to this method
#76 | 2007-10-11Microstructured chemical sensor
#77 | 2007-09-27Micromechanical component and corresponding manufacturing method
#78 | 2007-03-22Gas sensor and method for the production thereof
#79 | 2007-03-20Semiconductor component and a method for producing the same
#80 | 2007-01-09Method of producing a semiconductor sensor component
#81 | 2006-09-07Membrane sensor
#82 | 2006-07-27Pressure sensor featuring pressure loading of the fastening element
#83 | 2006-05-16Method for producing micromechanic sensors and sensors produced by said method
#84 | 2006-05-02Method for production of a semiconductor component and a semiconductor component produced by said method
#85 | 2006-03-16Micromechanical component and suitable method for its manufacture
#86 | 2006-02-23Method and micromechanical component
#87 | 2006-01-19Method for producing a semiconductor component and a semiconductor component produced according to the method
#88 | 2005-09-15Sensor assembly for measuring a gas concentration
#89 | 2005-06-14Micromechanical component
#90 | 2005-05-12Micromechanical structural element having a diaphragm and method for producing such a structural element
#91 | 2005-01-27Semiconductor element and method for its production
#92 | 2005-01-27Method for producing cavities having optically transparent wall
#93 | 2005-01-13Sensor element
#94 | 2005-01-11Micromechanical component and pressure sensor having a component of this type
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