Inventor profile of:

Eckhard Graf

City:

Gomaringen

Country:

Germany

Published Applications:

17

Last publication date:

2020-06-25

Top Assignees for applications by Eckhard Graf

The entities that hold a legal rights for patent applications filed by inventor Graf Eckhard:

Recent patent applications by Graf Eckhard

Eckhard Graf from Gomaringen, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2020-06-25
US20200198966A1
Performing operations; transporting

Micromechanical device and method for manufacturing a micromechanical device

#2 | 2018-12-06
US20180346324A1
Performing operations; transporting

MEMS component having two different internal pressures

#3 | 2015-05-21
US20150137329A1
Electricity

COMPONENT HAVING A VIA AND METHOD FOR MANUFACTURING IT

#4 | 2013-06-13
US20130147020A1
Electricity

Component having a via and method for manufacturing it

#5 | 2012-03-01
US20120049301A1
Performing operations; transporting

Method for producing a micromechanical component having a trench structure for backside contact

#6 | 2012-02-16
US20120038030A1
Electricity

Method for filling cavities in wafers, correspondingly filled blind hole and wafer having correspondingly filled insulation trenches

#7 | 2012-02-09
US20120032283A1
Physics

Sensor module

#8 | 2011-07-14
US20110169143A1
Performing operations; transporting

Method for establishing and closing a trench of a semiconductor component

#9 | 2010-06-03
US20100133630A1
Performing operations; transporting

Method for producing a micromechanical component having a trench structure for backside contact

#10 | 2010-04-15
US20100089868A1
Performing operations; transporting

Method for producing a micromechanical component having a filler layer and a masking layer

#11 | 2008-06-12
US20080136000A1
Performing operations; transporting

Micromechanical component having multiple caverns, and manufacturing method

#12 | 2006-12-26
US10829872
-

Micromechanical component as well as a method for producing a micromechanical component

#13 | 2005-10-18
US10433525
-

Method for joining a silicon plate to a second plate

#14 | 2005-10-04
US10203729
-

Method for manufacturing a micromechanical component and a component that is manufactured in accordance with the method

#15 | 2005-05-26
US20050112843A1
Electricity

Method for anodic bonding of wafers and device

#16 | 2005-04-05
US10066851
-

Micromechanical component as well as a method for producing a micromechanical component

#17 | 2005-03-03
US20050045973A1
Performing operations; transporting

Micromechanical cap structure and a corresponding production method

InventorID:

281883 ⎘