Pittsburgh, Pennsylvania
United States
7
2017-04-27
The entities that hold a legal rights for patent applications filed by inventor Ochs Eric:
Eric Ochs from Pittsburgh, US has applied for patents for these inventions. The list has both pending applications and granted patents:
MEMS CHIP SCALE PACKAGE
#2 | 2016-05-19CAVITY PACKAGE DESIGN
#3 | 2014-03-13MEMS microphone package with molded interconnect device
#4 | 2013-10-03Cavity package design
#5 | 2013-06-13MEMS CHIP SCALE PACKAGE
#6 | 2012-06-14Microphone package and method for manufacturing same
#7 | 2012-02-02Solder joint inspection
281907 ⎘