Hyung-lae EUN

City:

Gyeonggi-do

Country:

South Korea

Published Applications:

Last publication date:

2013-06-13

Top Assignees for applications by Hyung-lae EUN

The entities that hold a legal rights for patent applications filed by inventor EUN Hyung-lae:

Hyung-lae EUN from Gyeonggi-do, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

Multi-chip package having a stacked plurality of different sized semiconductor chips, and method of manufacturing the same

STACKED-TYPE SEMICONDUCTOR DEVICE PACKAGE

Stacked-type semiconductor device package

Semiconductor device package

InventorID:

281918 ⎘