BING DAI

City:

HARBIN

Country:

China

Published Applications:

Last publication date:

2020-08-27

Top Assignees for applications by BING DAI

The entities that hold a legal rights for patent applications filed by inventor DAI BING:

BING DAI from HARBIN, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

Direct growth methods for preparing diamond-assisted heat-dissipation silicon carbide substrates of GaN-HEMTs

InventorID:

2834996 ⎘