Robert FAUL

City:

Munich

Country:

Germany

Published Applications:

Last publication date:

2020-09-03

Top Assignees for applications by Robert FAUL

The entities that hold a legal rights for patent applications filed by inventor FAUL Robert:

Robert FAUL from Munich, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

Thin dual foil package including multiple foil substrates

Method of producing a chip package, and chip package

InventorID:

2839922 ⎘