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Inventor profile of:

Fei Yu

City:

Santa Clara, California

Country:

United States

Published Applications:

7

Last publication date:

2014-04-10

Top Assignees for applications by Fei Yu

The entities that hold a legal rights for patent applications filed by inventor Yu Fei:

  • Futurewei Technologies, Inc. 4 Plano, TX United States
  • HUAWEI TECHNOLOGIES CO., LTD. 2 Shenzhen, China

Recent patent applications by Yu Fei

Fei Yu from Santa Clara, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2014-04-10
US20140097333A1
Electricity

Apparatus and method for an optical package structure using aluminum nitride

#2 | 2014-01-30
US20140027157A1
Electricity

Device and Method for Printed Circuit Board with Embedded Cable

#3 | 2013-12-12
US20130330033A1
Physics

TSV SUBSTRATE WITH MIRROR AND ITS APPLICATION IN HIGH-SPEED OPTOELECTRONIC PACKAGING

#4 | 2013-08-15
US20130207127A1
Electricity

Apparatus and method for optical communications

#5 | 2013-07-25
US20130186676A1
Electricity

Methods and Apparatus for a Substrate Core Layer

#6 | 2013-06-13
US20130148922A1
Physics

Optical module manufacturing method and optical module

#7 | 2012-07-12
US20120175502A1
Physics

Optical module

InventorID:

284841 ⎘

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