Fabio BOTTINELLI

City:

Milano

Country:

Italy

Published Applications:

Last publication date:

2022-09-01

Top Assignees for applications by Fabio BOTTINELLI

The entities that hold a legal rights for patent applications filed by inventor BOTTINELLI Fabio:

Fabio BOTTINELLI from Milano, IT has applied for patents for these inventions. The list has both pending applications and granted patents:

Integrated electronic module for 3D sensing applications, and 3D scanning device including the integrated electronic module

Integrated electronic module for 3D sensing applications, and 3D scanning device including the integrated electronic module

InventorID:

2859110 ⎘