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Inventor profile of:

Ashwin Panday

City:

Boise, Idaho

Country:

United States

Published Applications:

6

Last publication date:

2025-11-27

Top Assignees for applications by Ashwin Panday

The entities that hold a legal rights for patent applications filed by inventor Panday Ashwin:

  • Micron Technology, Inc. 2 Boise, ID United States

Recent patent applications by Panday Ashwin

Ashwin Panday from Boise, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-11-27
US20250365920A1
Electricity

MULTI-SIDED STORAGE NODES IN THREE-DIMENSIONAL (3D) MEMORY

#2 | 2025-05-15
US20250159912A1
Electricity

APPARATUS INCLUDING BOTTOM ELECTRODES COMPRISING OXYGEN-DOPED TITANIUM NITRIDE MATERIALS AND RELATED ELECTRONIC DEVICES AND METHODS OF FORMING THE ELECTRONIC DEVICES

#3 | 2024-12-26
US20240431095A1
Electricity

SEMICONDUCTOR DEVICE WITH LINED CAPACITOR AND METHODS FOR MANUFACTURING THE SAME

#4 | 2024-11-21
US20240389302A1
Electricity

CONTACT FOOT WET PULLBACK WITH LINER WET PUNCH

#5 | 2022-09-08
US20220285357A1
Electricity

Integrated memory with redistribution of capacitor connections, and methods of forming integrated memory

#6 | 2020-10-01
US20200312954A1
Electricity

Semiconductor recess formation

InventorID:

2868142 ⎘

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