Inventor profile of:

Rishikesh Krishnan

City:

Poughkeepsie, New York

Country:

United States

Published Applications:

25

Last publication date:

2020-02-27

Top Assignees for applications by Rishikesh Krishnan

The entities that hold a legal rights for patent applications filed by inventor Krishnan Rishikesh:

Recent patent applications by Krishnan Rishikesh

Rishikesh Krishnan from Poughkeepsie, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2020-02-27
US20200066908A1
Electricity

FinFET with dielectric isolation after gate module for improved source and drain region epitaxial growth

#2 | 2018-04-05
US20180097113A1
Electricity

FinFET with dielectric isolation after gate module for improved source and drain region epitaxial growth

#3 | 2016-07-07
US20160197186A1
Electricity

FinFET with dielectric isolation after gate module for improved source and drain region epitaxial growth

#4 | 2016-02-04
US20160035878A1
Electricity

FinFET with dielectric isolation after gate module for improved source and drain region epitaxial growth

#5 | 2016-01-28
US20160027640A1
Electricity

Hydroxyl group termination for nucleation of a dielectric metallic oxide

#6 | 2015-12-17
US20150364362A1
Electricity

Wafer stress control with backside patterning

#7 | 2015-12-03
US20150349093A1
Electricity

finFET with dielectric isolation after gate module for improved source and drain region epitaxial growth

#8 | 2015-07-30
US20150214244A1
Electricity

STRUCTURE AND PROCESS TO DECOUPLE DEEP TRENCH CAPACITORS AND WELL ISOLATION

#9 | 2015-02-12
US20150044853A1
Electricity

Thermally stable high-K tetragonal HFO2 layer within high aspect ratio deep trenches

#10 | 2015-01-01
US20150001674A1
Electricity

Capacitors Having Dielectric Regions that Include Multiple Metal Oxide-Comprising Materials

#11 | 2014-10-16
US20140308821A1
Electricity

Hydroxyl group termination for nucleation of a dielectric metallic oxide

#12 | 2014-07-03
US20140183051A1
Chemistry; metallurgy

DEPOSITION OF PURE METALS IN 3D STRUCTURES

#13 | 2014-02-27
US20140057426A1
Electricity

Non-volatile memory structure employing high-k gate dielectric and metal gate

#14 | 2013-08-22
US20130217219A1
Electricity

Replacement gate with reduced gate leakage current

#15 | 2013-08-08
US20130200482A1
Electricity

Shallow trench isolation for device including deep trench capacitors

#16 | 2013-07-11
US20130175665A1
Electricity

Thermally stable high-K tetragonal HFOlayer within high aspect ratio deep trenches

#17 | 2013-05-02
US20130105879A1
Electricity

Non-volatile memory structure employing high-k gate dielectric and metal gate

#18 | 2013-01-10
US20130011990A1
Chemistry; metallurgy

Methods of making crystalline tantalum pentoxide

#19 | 2012-12-20
US20120320494A1
Electricity

Capacitors having dielectric regions that include multiple metal oxide-comprising materials

#20 | 2012-11-08
US20120282754A1
Electricity

Methods of forming capacitors having dielectric regions that include multiple metal oxide-comprising materials

#21 | 2012-08-02
US20120196424A1
Electricity

Method of fabricating a deep trench (DT) metal-insulator-metal (MIM) capacitor

#22 | 2012-07-19
US20120181630A1
Electricity

Replacement gate with reduced gate leakage current

#23 | 2011-12-08
US20110300721A1
Chemistry; metallurgy

Methods of making crystalline tantalum pentoxide

#24 | 2010-12-16
US20100316793A1
Electricity

Methods of forming capacitors having dielectric regions that include multiple metal oxide-comprising materials

#25 | 2010-12-16
US20100315760A1
Electricity

Capacitors having dielectric regions that include multiple metal oxide-comprising materials

InventorID:

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