William James Scott

City:

Mesa, Arizona

Country:

United States

Published Applications:

Last publication date:

2025-01-23

Recent patent applications by Scott William James

William James Scott from Mesa, US has applied for patents for these inventions. The list has both pending applications and granted patents:

MODULAR SEALED CONDUIT JOINING SYSTEMS AND METHODS

MODULAR SEALED CONDUIT JOINING SYSTEMS AND METHODS

Gaskets for High and Low-Pressure and High Temperature Applications

Systems and methods for a cellular phone enclosure

Systems and methods for a cellular phone enclosure

InventorID:

2906573 ⎘