Toru MAEDA

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2024-09-12

Top Assignees for applications by Toru MAEDA

The entities that hold a legal rights for patent applications filed by inventor MAEDA Toru:

Toru MAEDA from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

COMPOSITE MATERIAL, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING COMPOSITE MATERIAL

Aluminum alloy plate, terminal, electric wire with terminal, and bus bar

COMPOSITE MATERIAL, HEAT SPREADER AND SEMICONDUCTOR PACKAGE

ALUMINUM ALLOY WIRE AND METHOD FOR PRODUCING ALUMINUM ALLOY WIRE

InventorID:

2909950 ⎘