JOHN WILLIAM TOWNSEND

City:

TEMECULA, California

Country:

United States

Published Applications:

Last publication date:

2020-11-19

Recent patent applications by TOWNSEND JOHN WILLIAM

JOHN WILLIAM TOWNSEND from TEMECULA, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2020-11-19

US20200363180A1

Mechanical engineering

Stability Improvement for Ammunition Reloading Process

#2 | 2011-07-07

US20110163503A1

Mechanical engineering

Reactive Target shooting system

InventorID:

2910625 ⎘