Boise, Idaho
United States
15
2026-01-29
The entities that hold a legal rights for patent applications filed by inventor Kim Dojun:
Dojun Kim from Boise, US has applied for patents for these inventions. The list has both pending applications and granted patents:
EPITAXIAL GROWTH FOR SUBSTRATE ISOLATION IN A THREE DIMENSIONAL (3D) MEMORY ARRAY
#2 | 2026-01-29DIGIT LINE FORMATION IN VERTICAL THREE-DIMENSIONAL (3D) MEMORY
#3 | 2025-11-27MULTI-SIDED STORAGE NODES IN THREE-DIMENSIONAL (3D) MEMORY
#4 | 2025-11-20ENHANCED CONTACTS IN VERTICAL THREE-DIMENSIONAL (3D) MEMORY
#5 | 2025-09-18Memory Circuitry And Methods Used In Forming Memory Circuitry
#6 | 2025-05-15APPARATUS INCLUDING BOTTOM ELECTRODES COMPRISING OXYGEN-DOPED TITANIUM NITRIDE MATERIALS AND RELATED ELECTRONIC DEVICES AND METHODS OF FORMING THE ELECTRONIC DEVICES
#7 | 2024-12-26SEMICONDUCTOR DEVICE WITH LINED CAPACITOR AND METHODS FOR MANUFACTURING THE SAME
#8 | 2024-07-11MICROELECTRONIC DEVICES INCLUDING CAPACITORS, AND RELATED ELECTRONIC SYSTEMS AND METHODS
#9 | 2024-04-25MICROELECTRONIC DEVICES INCLUDING CAPACITORS, AND RELATED ELECTRONIC SYSTEMS AND METHODS
#10 | 2022-01-27ELECTRODE/DIELECTRIC BARRIER MATERIAL FORMATION AND STRUCTURES
#11 | 2021-11-18METHODS OF FORMING ELECTRONIC APPARATUS WITH TITANIUM NITRIDE CONDUCTIVE STRUCTURES, AND RELATED ELECTRONIC APPARATUS AND SYSTEMS
#12 | 2021-10-12Electrode/dielectric barrier material formation and structures
#13 | 2021-01-14Electrode formation
#14 | 2021-01-14Apparatus including barrier materials within access line structures, and related methods and electronic systems
#15 | 2020-11-19Forming a barrier material on an electrode
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