Daisuke Kusuda

City:

Yao-shi

Country:

Japan

Published Applications:

Last publication date:

2020-11-26

Top Assignees for applications by Daisuke Kusuda

The entities that hold a legal rights for patent applications filed by inventor Kusuda Daisuke:

Daisuke Kusuda from Yao-shi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Electronic component assembly, combination of electronic component assembly and adherend, and method for mounting electronic component

InventorID:

2920409 ⎘