Shinsuke ISHIKAWA

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2025-01-30

Top Assignees for applications by Shinsuke ISHIKAWA

The entities that hold a legal rights for patent applications filed by inventor ISHIKAWA Shinsuke:

Shinsuke ISHIKAWA from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

THERMOSETTING RESIN COMPOSITION, RESIN COMPOSITION FOR PRINTED WIRING BOARD, AND RESIN COMPOSITION FOR PRINTED WIRING BOARD SUBSTRATE

METHOD FOR PRODUCING MOLD, AND METHOD FOR PRODUCING MOLDED ARTICLE USING SAME

InventorID:

2922073 ⎘