Hideki KASHIHARA

City:

Shiga

Country:

Japan

Published Applications:

Last publication date:

2022-08-25

Top Assignees for applications by Hideki KASHIHARA

The entities that hold a legal rights for patent applications filed by inventor KASHIHARA Hideki:

SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. 3 Shiga, Japan
SUMITOMO ELECTRIC INDUSTRIES, LTD. 2 Osaka, Japan

Recent patent applications by KASHIHARA Hideki

Hideki KASHIHARA from Shiga, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2022-08-25

US20220272838A1

Electricity

Method for manufacturing dielectric sheet, method for manufacturing substrate for high-frequency printed wiring board, dielectric sheet, and substrate for high-frequency printed wiring board

#2 | 2021-01-14

US20210014968A1

Electricity

Cover film for flexible printed circuit board and flexible printed circuit board

#3 | 2020-12-03

US20200376810A1

Performing operations; transporting

Resin film, substrate for printed wiring board, and printed wiring board

InventorID:

2922158 ⎘