Daisuke MURANO

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2023-10-12

Top Assignees for applications by Daisuke MURANO

The entities that hold a legal rights for patent applications filed by inventor MURANO Daisuke:

Daisuke MURANO from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

POLY (PHENYLENE SULFIDE) RESIN COMPOSITION AND VIBRATION DAMPING MATERIAL INCLUDING SAME

HALOGENATED POLYPHENYLENE SULFIDE RESIN, RESIN COMPOSITION, MOLDED ARTICLE, AND VIBRATION-DAMPING AGENT FOR RESIN

POLYAMIDE PARTICLES AND METHOD FOR PRODUCING POLYAMIDE PARTICLES

POLYAMIDE COMPOSITION AND METHOD FOR PRODUCING POLYAMIDE COMPOSITION

POLYAMIDE PARTICLES AND METHOD FOR PRODUCING POLYAMIDE PARTICLES

InventorID:

2922984 ⎘