Wanli LI

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2021-11-25

Top Assignees for applications by Wanli LI

The entities that hold a legal rights for patent applications filed by inventor LI Wanli:

Wanli LI from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Method for synthesizing copper-silver alloy, method for forming conduction part, copper-silver alloy, and conduction part

Method for synthesizing copper-silver alloy, method for forming conduction part, copper-silver alloy, and conduction part

InventorID:

2926435 ⎘