Inventor profile of:

Young Do Kweon

City:

Suwon

Country:

South Korea

Published Applications:

20

Last publication date:

2015-07-02

Top Assignees for applications by Young Do Kweon

The entities that hold a legal rights for patent applications filed by inventor Kweon Young Do:

Recent patent applications by Kweon Young Do

Young Do Kweon from Suwon, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2015-07-02
US20150189757A1
Electricity

Electronic component embedded substrate

#2 | 2015-05-28
US20150145629A1
Electricity

Electronic component and circuit board having the same mounted thereon

#3 | 2015-05-28
US20150145617A1
Electricity

Common mode filter and method of manufacturing the same

#4 | 2015-04-16
US20150102886A1
Electricity

Common mode filter

#5 | 2015-04-16
US20150102884A1
Electricity

Common mode filter

#6 | 2015-03-31
US14250998
Electricity

Common mode filter

#7 | 2015-02-26
US20150055312A1
Electricity

INTERPOSER SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

#8 | 2015-02-12
US20150041180A1
Electricity

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

#9 | 2015-01-01
US20150000958A1
Electricity

PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME

#10 | 2014-11-20
US20140338955A1
Electricity

PRINTED CIRCUIT BOARD

#11 | 2014-10-02
US20140292469A1
Electricity

POWER INDUCTOR AND MANUFACTURING METHOD THEREOF

#12 | 2014-07-10
US20140192446A1
Electricity

ELECTROSTATIC DISCHARGE PROTECTION DEVICE AND METHOD FOR MANUFACTURING THE SAME

#13 | 2014-07-03
US20140182915A1
Electricity

Circuit board and method for manufacturing the same

#14 | 2014-07-03
US20140182905A1
Electricity

PRINTED CIRCUIT BOARD AND SURFACE TREATMENT METHOD OF PRINTED CIRCUIT BOARD

#15 | 2014-06-26
US20140176278A1
Electricity

INDUCTOR AND MANUFACTURING METHOD THEREOF

#16 | 2014-06-19
US20140166347A1
Electricity

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

#17 | 2014-04-17
US20140104798A1
Electricity

HYBRID LAMINATION SUBSTRATE, MANUFACTURING METHOD THEREOF AND PACKAGE SUBSTRATE

#18 | 2014-03-20
US20140077896A1
Electricity

Via structure having open stub and printed circuit board having the same

#19 | 2013-07-04
US20130168132A1
Electricity

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

#20 | 2013-06-20
US20130153266A1
Electricity

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

InventorID:

293078 ⎘