Raleigh, North Carolina
United States
134
2024-06-27
The entities that hold a legal rights for patent applications filed by inventor Bower Christopher:
Christopher Bower from Raleigh, US has applied for patents for these inventions. The list has both pending applications and granted patents:
COMPOUND MICRO-ASSEMBLY STRATEGIES AND DEVICES
#2 | 2024-05-23CHIPLETS WITH CONNECTION POSTS
#3 | 2024-05-09Micro assembled LED displays and lighting elements
#4 | 2023-05-11Chiplets with connection posts
#5 | 2022-07-07OLEDS FOR MICRO TRANSFER PRINTING
#6 | 2021-12-09Devices with a single metal layer
#7 | 2021-12-02Micro-transfer-printed acoustic wave filter device
#8 | 2021-10-07MAGNETIC FIELD SENSOR AND METHOD FOR MAKING SAME
#9 | 2021-07-22Micro assembled LED displays and lighting elements
#10 | 2021-06-03Printable device wafers with sacrificial layers
#11 | 2021-04-22Electrically parallel fused LEDs
#12 | 2020-07-30Chiplets with connection posts
#13 | 2020-04-02Chiplets with connection posts
#14 | 2020-03-26Wafers with etchable sacrificial patterns, anchors, tethers, and printable devices
#15 | 2020-02-13Devices with a single metal layer
#16 | 2019-12-19Micro-transfer-printable flip-chip structures and methods
#17 | 2019-12-05Chiplets with connection posts
#18 | 2019-10-24Printable inorganic semiconductor structures
#19 | 2019-10-24Micro-transfer-printable flip-chip structures and methods
#20 | 2019-07-18Efficiently micro-transfer printing micro-scale devices onto large-format substrates
#21 | 2019-05-23OLEDs for micro transfer printing
#22 | 2019-05-16Micro assembled LED displays and lighting elements
#23 | 2019-04-25Micro-transfer-printed acoustic wave filter device
#24 | 2019-03-21Methods of making printable device wafers with sacrificial layers
#25 | 2019-03-21Micro-transfer printable electronic component
#26 | 2019-03-21Micro-transfer-printable flip-chip structures and methods
#27 | 2019-03-14Hybrid banknote with electronic indicia
#28 | 2019-01-31Printable inorganic semiconductor structures
#29 | 2018-11-29Parallel redundant chiplet system with printed circuits for reduced faults
#30 | 2018-09-27Methods for surface attachment of flipped active components
#31 | 2018-09-06Systems and methods for preparing GaN and related materials for micro assembly
#32 | 2018-08-09Micro-transfer-printable flip-chip structures and methods
#33 | 2018-07-19Systems and methods for controlling release of transferable semiconductor structures
#34 | 2018-06-14Systems and methods for controlling release of transferable semiconductor structures
#35 | 2018-05-31Redistribution layer for substrate contacts
#36 | 2018-05-24Method for producing a semiconductor component and a semiconductor component
#37 | 2018-05-17Micro-transfer-printable flip-chip structures and methods
#38 | 2018-05-10Printable device wafers with sacrificial layers
#39 | 2018-05-10Interconnection structures and methods for transfer-printed integrated circuit elements with improved interconnection alignment tolerance
#40 | 2018-05-10Spatially dithered high-resolution
#41 | 2018-05-03LED optical components
#42 | 2018-04-12Magnetic field sensor and method for making same
#43 | 2018-03-22Multi-LED components
#44 | 2018-02-08Crystalline color-conversion device
#45 | 2018-02-01Devices with a single metal layer
#46 | 2018-02-01Chiplets with wicking posts
#47 | 2018-01-04Electrically parallel fused LEDs
#48 | 2018-01-04Printable inorganic semiconductor structures
#49 | 2018-01-04APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING
#50 | 2017-12-14Systems and methods for preparing GaN and related materials for micro assembly
#51 | 2017-12-14LED structure with polarized light emission
#52 | 2017-12-07Micro-transfer-printed light-emitting diode device
#53 | 2017-11-30Hybrid banknote with electronic indicia using near-field-communications
#54 | 2017-11-23Compound micro-transfer-printed power transistor device
#55 | 2017-11-16Magnetic field sensor and method for making same
#56 | 2017-11-02Hybrid document with variable state
#57 | 2017-10-26Transverse bulk acoustic wave filter
#58 | 2017-10-26Display tile structure and tiled display
#59 | 2017-10-19Hybrid banknote with electronic indicia using near-field-communications
#60 | 2017-09-07Micro-transfer printable electronic component
#61 | 2017-08-31Inorganic LED pixel structure
#62 | 2017-08-31Efficiently micro-transfer printing micro-scale devices onto large-format substrates
#63 | 2017-08-31Hybrid banknote with electronic indicia
#64 | 2017-08-24Micro-transfer-printed acoustic wave filter device
#65 | 2017-08-24Compound micro-transfer-printed optical filter device
#66 | 2017-07-27Methods for surface attachment of flipped active components
#67 | 2017-07-20Printable inorganic semiconductor structures
#68 | 2017-07-20APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING
#69 | 2017-06-29Matrix addressed device repair
#70 | 2017-06-01Systems and methods for controlling release of transferable semiconductor structures
#71 | 2017-05-18Printed capacitors
#72 | 2017-05-11Printable device wafers with sacrificial layers gaps
#73 | 2017-05-04Display with color conversion
#74 | 2017-04-13Apparatus and methods for micro-transfer-printing
#75 | 2017-03-30OLEDs for micro transfer printing
#76 | 2017-03-02Bit-plane pulse width modulated digital display system
#77 | 2017-03-02Heterogeneous light emitter display system
#78 | 2017-02-16Chiplets with connection posts
#79 | 2017-02-16Display tile structure and tiled display
#80 | 2017-02-16Stamp with structured posts
#81 | 2017-02-16Printable component structure with electrical contact
#82 | 2017-01-26Redistribution layer for substrate contacts
#83 | 2017-01-26Parallel redundant chiplet system for controlling display pixels
#84 | 2017-01-05Inorganic light-emitting diode with encapsulating reflector
#85 | 2016-12-15Crystalline color-conversion device
#86 | 2016-12-15Distributed charge-pump power-supply system
#87 | 2016-12-01Inorganic-light-emitter display with integrated black matrix
#88 | 2016-11-24Micro assembled LED displays and lighting elements
#89 | 2016-11-24Small-aperture-ratio display with electrical component
#90 | 2016-11-17Printable inorganic semiconductor structures
#91 | 2016-09-01Method for producing a semiconductor component and a semiconductor component
#92 | 2016-08-04Method for producing a semiconductor component and a semiconductor component
#93 | 2016-03-31COMPOUND MICRO-ASSEMBLY STRATEGIES AND DEVICES
#94 | 2016-03-24Systems and methods for controlling release of transferable semiconductor structures
#95 | 2016-03-03Micro assembled hybrid displays and lighting elements
#96 | 2016-02-25High-yield fabrication of large-format substrates with distributed, independent control elements
#97 | 2016-01-21APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING
#98 | 2016-01-21Apparatus and methods for micro-transfer-printing
#99 | 2016-01-21Apparatus and methods for micro-transfer-printing
#100 | 2016-01-21Apparatus and methods for micro-transfer-printing
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