Durham, North Carolina
United States
164
2024-06-27
The entities that hold a legal rights for patent applications filed by inventor Meitl Matthew:
Matthew Meitl from Durham, US has applied for patents for these inventions. The list has both pending applications and granted patents:
COMPOUND MICRO-ASSEMBLY STRATEGIES AND DEVICES
#2 | 2024-05-23CHIPLETS WITH CONNECTION POSTS
#3 | 2024-05-09Micro assembled LED displays and lighting elements
#4 | 2023-10-26Multi-level micro-device tethers
#5 | 2023-05-11Chiplets with connection posts
#6 | 2022-07-07OLEDS FOR MICRO TRANSFER PRINTING
#7 | 2022-06-23Optical systems fabricated by printing-based assembly
#8 | 2022-03-17Device source wafers with patterned dissociation interfaces
#9 | 2021-12-09Devices with a single metal layer
#10 | 2021-12-02Micro-transfer-printed acoustic wave filter device
#11 | 2021-11-04Methods and devices for fabricating and assembling printable semiconductor elements
#12 | 2021-10-07MAGNETIC FIELD SENSOR AND METHOD FOR MAKING SAME
#13 | 2021-07-22Micro assembled LED displays and lighting elements
#14 | 2021-06-03Printable device wafers with sacrificial layers
#15 | 2021-04-22Electrically parallel fused LEDs
#16 | 2020-10-22Multi-level micro-device tethers
#17 | 2020-07-30Chiplets with connection posts
#18 | 2020-05-28Device source wafers with patterned dissociation interfaces
#19 | 2020-05-21Optical systems fabricated by printing-based assembly
#20 | 2020-04-02Chiplets with connection posts
#21 | 2020-03-26Wafers with etchable sacrificial patterns, anchors, tethers, and printable devices
#22 | 2020-02-13Interconnection by lateral transfer printing
#23 | 2020-02-13FLEXIBLE DEVICES AND METHODS USING LASER LIFT-OFF
#24 | 2020-02-13Devices with a single metal layer
#25 | 2020-01-02Methods and devices for fabricating and assembling printable semiconductor elements
#26 | 2019-12-19Micro-transfer-printable flip-chip structures and methods
#27 | 2019-12-05Chiplets with connection posts
#28 | 2019-11-14Flexible devices and methods using laser lift-off
#29 | 2019-10-24Printable inorganic semiconductor structures
#30 | 2019-10-24Micro-transfer-printable flip-chip structures and methods
#31 | 2019-08-29Displays with transparent bezels
#32 | 2019-08-29Displays with transparent bezels
#33 | 2019-07-25Device source wafers with patterned dissociation interfaces
#34 | 2019-07-18Efficiently micro-transfer printing micro-scale devices onto large-format substrates
#35 | 2019-05-23OLEDs for micro transfer printing
#36 | 2019-05-23Interconnection by lateral transfer printing
#37 | 2019-05-21Multi-resolution compound micro-devices
#38 | 2019-05-16Micro assembled LED displays and lighting elements
#39 | 2019-04-25Micro-transfer-printed acoustic wave filter device
#40 | 2019-03-21Methods of making printable device wafers with sacrificial layers
#41 | 2019-03-21Micro-transfer printable electronic component
#42 | 2019-03-21Micro-transfer-printable flip-chip structures and methods
#43 | 2019-02-14Multi-level micro-device tethers
#44 | 2019-01-31Printable inorganic semiconductor structures
#45 | 2018-11-29Parallel redundant chiplet system with printed circuits for reduced faults
#46 | 2018-11-08Structures and methods for electrical connection of micro-devices and substrates
#47 | 2018-10-04MICRO-DEVICE POCKETS FOR TRANSFER PRINTING
#48 | 2018-09-06Systems and methods for preparing GaN and related materials for micro assembly
#49 | 2018-08-09Micro-transfer-printable flip-chip structures and methods
#50 | 2018-07-19Systems and methods for controlling release of transferable semiconductor structures
#51 | 2018-06-14Systems and methods for controlling release of transferable semiconductor structures
#52 | 2018-05-31Redistribution layer for substrate contacts
#53 | 2018-05-24Method for producing a semiconductor component and a semiconductor component
#54 | 2018-05-17Micro-transfer-printable flip-chip structures and methods
#55 | 2018-05-10Printable device wafers with sacrificial layers
#56 | 2018-05-10Spatially dithered high-resolution
#57 | 2018-05-03LED optical components
#58 | 2018-04-12Magnetic field sensor and method for making same
#59 | 2018-04-05Micro-transfer printing with volatile adhesive layer
#60 | 2018-03-29Pressure-activated electrical interconnection by micro-transfer printing
#61 | 2018-02-08Crystalline color-conversion device
#62 | 2018-02-01Devices with a single metal layer
#63 | 2018-02-01Chiplets with wicking posts
#64 | 2018-01-04Electrically parallel fused LEDs
#65 | 2018-01-04Printable inorganic semiconductor structures
#66 | 2018-01-04APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING
#67 | 2017-12-14Systems and methods for preparing GaN and related materials for micro assembly
#68 | 2017-12-14LED structure with polarized light emission
#69 | 2017-12-07Voltage-balanced serial iLED pixel and display
#70 | 2017-11-23Compound micro-transfer-printed power transistor device
#71 | 2017-11-16Magnetic field sensor and method for making same
#72 | 2017-10-26Transverse bulk acoustic wave filter
#73 | 2017-10-26Methods and devices for fabricating and assembling printable semiconductor elements
#74 | 2017-10-26Display tile structure and tiled display
#75 | 2017-10-05Pressure-activated electrical interconnection by micro-transfer printing
#76 | 2017-09-21Display with fused LEDs
#77 | 2017-09-07Micro-printed display
#78 | 2017-09-07Micro-transfer printable electronic component
#79 | 2017-08-31Efficiently micro-transfer printing micro-scale devices onto large-format substrates
#80 | 2017-08-24Micro-transfer-printed acoustic wave filter device
#81 | 2017-07-20Printable inorganic semiconductor structures
#82 | 2017-07-20APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING
#83 | 2017-06-29Matrix addressed device repair
#84 | 2017-06-22Optical systems fabricated by printing-based assembly
#85 | 2017-06-22Optical systems fabricated by printing-based assembly
#86 | 2017-06-22Optical systems fabricated by printing-based assembly
#87 | 2017-06-01Systems and methods for controlling release of transferable semiconductor structures
#88 | 2017-05-18Printed capacitors
#89 | 2017-05-11Printable device wafers with sacrificial layers gaps
#90 | 2017-05-04Display with color conversion
#91 | 2017-04-13Apparatus and methods for micro-transfer-printing
#92 | 2017-04-06Wafer-integrated, ultra-low profile concentrated photovoltaics (CPV) for space applications
#93 | 2017-03-30MINIATURIZED DEVICES FOR COMBINED OPTICAL POWER CONVERSION AND DATA TRANSMISSION
#94 | 2017-03-30Layers of safety and failsafe capability for operation of class IV laser in consumer electronics devices
#95 | 2017-03-30OLEDs for micro transfer printing
#96 | 2017-03-02Heterogeneous light emitter display system
#97 | 2017-02-16Chiplets with connection posts
#98 | 2017-02-16Display tile structure and tiled display
#99 | 2017-02-16Stamp with structured posts
#100 | 2017-02-16Printable component structure with electrical contact
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