Inventor profile of:

Yeong-E CHEN

City:

Miao-Li County

Country:

Taiwan

Published Applications:

36

Last publication date:

2026-02-19

Top Assignees for applications by Yeong-E CHEN

The entities that hold a legal rights for patent applications filed by inventor CHEN Yeong-E:

Recent patent applications by CHEN Yeong-E

Yeong-E CHEN from Miao-Li County, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-02-19
US20260052783A1
Electricity

ELECTRONIC DEVICE

#2 | 2025-10-30
US20250338394A1
Electricity

ELECTRONIC DEVICE

#3 | 2025-08-07
US20250253190A1
Electricity

METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE

#4 | 2025-05-01
US20250140645A1
Electricity

ELECTRONIC DEVICE

#5 | 2025-04-10
US20250118605A1
Electricity

ELECTRONIC DEVICE

#6 | 2025-02-06
US20250046623A1
Electricity

METHOD FOR MANUFACTURING ELECTRONIC DEVICE

#7 | 2025-01-23
US20250029907A1
Electricity

PACKAGE DEVICE

#8 | 2024-11-21
US20240389229A1
Electricity

ELECTRONIC DEVICE

#9 | 2024-10-10
US20240337872A1
Physics

ELECTRONIC DEVICE

#10 | 2024-01-18
US20240023235A1
Electricity

Package device

#11 | 2024-01-04
US20240006249A1
Electricity

Electronic device

#12 | 2023-09-14
US20230290764A1
Electricity

Electronic device

#13 | 2023-08-03
US20230245949A1
Electricity

Electronic device

#14 | 2023-05-25
US20230164912A1
Electricity

Package device and manufacturing method thereof

#15 | 2023-03-30
US20230095239A1
Electricity

Method for manufacturing an electronic device

#16 | 2023-03-23
US20230090376A1
Electricity

Electronic component and manufacturing method thereof

#17 | 2023-03-09
US20230077312A1
Electricity

Method for manufacturing electronic device

#18 | 2023-02-09
US20230038309A1
Electricity

PACKAGE DEVICE

#19 | 2022-10-20
US20220334423A1
Physics

Electronic device

#20 | 2022-10-13
US20220330430A1
Electricity

Bonding pad structure

#21 | 2022-10-06
US20220319995A1
Electricity

Package device

#22 | 2022-09-22
US20220299565A1
Physics

Method for manufacturing electronic device having a seed layer on a substrate

#23 | 2022-09-08
US20220285294A1
Electricity

Package device

#24 | 2022-06-09
US20220181189A1
Electricity

Manufacturing method of semiconductor package

#25 | 2022-06-02
US20220173000A1
Electricity

MANUFACTURING METHOD OF PACKAGE CIRCUIT

#26 | 2022-05-26
US20220167495A1
Electricity

Package device

#27 | 2022-05-26
US20220165679A1
Electricity

PACKAGE DEVICE AND MANUFACTURING METHOD THEREOF

#28 | 2022-05-26
US20220165628A1
Electricity

Manufacturing method of package device

#29 | 2022-05-19
US20220157703A1
Electricity

Package device and manufacturing method thereof

#30 | 2022-05-12
US20220148972A1
Electricity

Package device and a manufacturing method thereof

#31 | 2022-04-28
US20220130715A1
Electricity

Method for manufacturing an electronic device

#32 | 2022-04-28
US20220130683A1
Electricity

Method for manufacturing an electronic device

#33 | 2021-11-04
US20210341534A1
Physics

Method for manufacturing electronic device having a seed layer on a substrate

#34 | 2021-10-28
US20210335764A1
Electricity

Electronic device and fabrication method thereof

#35 | 2021-10-28
US20210333625A1
Physics

LIQUID-CRYSTAL DEVICE AND SUN-GLASSES

#36 | 2020-12-17
US20200396835A1
Electricity

Bonding pad structure

InventorID:

2940289 ⎘