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Inventor profile of:

Ryosuke HARADA

City:

Osaka

Country:

Japan

Published Applications:

7

Last publication date:

2024-08-29

Top Assignees for applications by Ryosuke HARADA

The entities that hold a legal rights for patent applications filed by inventor HARADA Ryosuke:

  • SEKISUI KASEI CO., LTD. 6 Osaka, Japan
  • SEKISUI PLASTICS CO., LTD. 3 Osaka, Japan

Recent patent applications by HARADA Ryosuke

Ryosuke HARADA from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-08-29
US20240287228A1
Chemistry; metallurgy

HOLLOW POLYMER PARTICLES AND METHOD FOR MANUFACTURING SAME

#2 | 2024-02-22
US20240059810A1
Chemistry; metallurgy

HOLLOW RESIN PARTICLES USED IN RESIN COMPOSITION FOR SEMICONDUCTOR MEMBER

#3 | 2022-02-10
US20220041775A1
Chemistry; metallurgy

HOLLOW POLYMER PARTICLES AND METHOD FOR MANUFACTURING SAME

#4 | 2021-11-11
US20210347923A1
Chemistry; metallurgy

Vinyl-based resin particles and method for producing same

#5 | 2020-12-24
US20200399413A1
Chemistry; metallurgy

VINYL-BASED RESIN PARTICLES AND METHOD FOR MANUFACTURING SAME

#6 | 2020-04-30
US20200131306A1
Chemistry; metallurgy

Spherical polyester resin particles and method for producing same

#7 | 2019-09-19
US20190284320A1
Chemistry; metallurgy

Fluorescent resin particles and use thereof

InventorID:

2942590 ⎘

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