Tempe, Arizona
United States
18
2018-09-20
The entities that hold a legal rights for patent applications filed by inventor Sanchez Audel A.:
Audel A. Sanchez from Tempe, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Methods of manufacturing packaged electronic devices with top terminations
#2 | 2016-06-09Radio frequency devices with surface-mountable capacitors for decoupling and methods thereof
#3 | 2016-06-09SYSTEM, METHOD AND APPARATUS FOR LEADLESS SURFACE MOUNTED SEMICONDUCTOR PACKAGE
#4 | 2016-05-26Packaged electronic devices with top terminations, and methods of manufacture thereof
#5 | 2015-12-31Radio frequency devices with surface-mountable capacitors for decoupling and methods thereof
#6 | 2015-11-24Tape release systems and methods for semiconductor dies
#7 | 2015-09-03Packaged leadless semiconductor device
#8 | 2015-06-18Method and apparatus for multi-chip structure semiconductor package
#9 | 2015-04-30Die crack detector with integrated one-time programmable element
#10 | 2015-04-30Devices and methods of operation for separating semiconductor die from adhesive tape
#11 | 2014-11-13System, method and apparatus for leadless surface mounted semiconductor package
#12 | 2014-09-11Methods for bonding a die and a substrate
#13 | 2014-09-11Semiconductor devices that include a die bonded to a substrate with a gold interface layer
#14 | 2014-03-27Method and apparatus for multi-chip structure semiconductor package
#15 | 2013-12-05System, method and apparatus for leadless surface mounted semiconductor package
#16 | 2013-06-20Packaged leadless semiconductor device
#17 | 2011-07-07Die bonding a semiconductor device
#18 | 2006-01-19Method of assembling a semiconductor component and apparatus therefor
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