Gilbert, Arizona
United States
25
2025-01-16
The entities that hold a legal rights for patent applications filed by inventor Celaya Phillip:
Phillip Celaya from Gilbert, US has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR PACKAGES WITH WETTABLE FLANKS AND RELATED METHODS
#2 | 2020-10-01Semiconductor devices and methods of making the same
#3 | 2019-08-08Semiconductor packages
#4 | 2018-05-17Semiconductor packages with leadframes and related methods
#5 | 2018-03-29LONG-LASTING WETTABLE FLANKS
#6 | 2017-03-02Semiconductor devices and methods of making the same
#7 | 2017-01-26Semiconductor component and method of manufacture
#8 | 2016-06-30Semiconductor packages and related methods
#9 | 2015-02-05METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT AND STRUCTURE
#10 | 2014-08-28Dual-flag stacked die package
#11 | 2014-06-05METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT AND STRUCTURE THEREFOR
#12 | 2013-06-20Method of forming a semiconductor device and leadframe therefor
#13 | 2011-12-08Semiconductor component and method of manufacture
#14 | 2011-11-17Method for manufacturing a semiconductor component
#15 | 2011-03-24Multi-chip semiconductor connector
#16 | 2010-07-29Method for manufacturing a semiconductor component and structure therefor
#17 | 2010-03-04Semiconductor package and method therefor
#18 | 2008-03-06Semiconductor package structure having multiple heat dissipation paths and method of manufacture
#19 | 2008-03-06Semiconductor package and method therefor
#20 | 2008-01-10Multi-chip semiconductor connector assemblies
#21 | 2007-06-07Multi-chip semiconductor connector assembly method
#22 | 2007-06-07Multi-chip semiconductor connector and method
#23 | 2005-12-29Multi-chip semiconductor connector assembly method
#24 | 2005-12-29Multi-chip semiconductor connector assemblies
#25 | 2005-12-29Multi-chip semiconductor connector and method
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