Eugene M. Chow

MICROCHIP CHARGE PATTERNING

Superconducting stress-engineered micro-fabricated springs

Superconducting stress-engineered micro-fabricated springs

Print Head Design for Ballistic Aerosol Marking with Smooth Particulate Injection from an Array of Inlets into a Matching Array of Microchannels

POINT OF CARE URINE TESTER AND METHOD

Transparent optical coupler active matrix array

Microchip charge patterning

Polysensing bioelectronic test plate

Monitor for particle injector

System and method for enhancing particle delivery to biological tissue

Alignment of elongated particles in a particle delivery device

Method of producing an interposer with microspring contacts

POINT OF CARE URINE TESTER AND METHOD

Monitor for particle injector

Direct electrostatic assembly with capacitively coupled electrodes

Fabrication method for microelectronic components and microchip inks used in electrostatic assembly

Print head design for ballistic aerosol marking with smooth particulate injection from an array of inlets into a matching array of microchannels

Micro-truss structures having in-plane structural members

Method for reduction of stiction while manipulating micro objects on a surface

Digital 3D fabrication using multi-layered mold

Flexible metal interconnect structure

Micro-plasma generation using micro-springs

Micro-plasma generation using micro-springs

Microchip charge patterning

Microchip charge patterning

Multilevel IC package using interconnect springs

Micro-spring chip attachment using ribbon bonds

Method of Producing an Interposer with Microspring Contacts

Stress-engineered interconnect packages with activator-assisted molds

Microspring structures adapted for target device cooling

Printed circuit boards by massive parallel assembly

Method for fabricating multi-chip module with multi-level interposer

Airgap micro-spring interconnect with bonded underfill seal

Microsprings partially embedded in a laminate structure and methods for producing same

Interposer with microspring contacts

Imaging members for ink-based digital printing comprising structured organic films

Contact spring application to semiconductor devices

Alignment structures for integrated-circuit packaging

Multi-chip module with multi-level interposer

Digital gravure printing with a pixilated photoconductor

Digital printing plate and system with electrostatically latched deformable membranes

Anilox metering system for electrographic printing

Anilox metering system for electrographic printing

Stress-engineered interconnect packages with activator-assisted molds

Airgap micro-spring interconnect with bonded underfill seal

Nanocalorimeter based on thermal probes

Pattern-print thin-film transistors with top gate geometry

IMAGING MEMBER

Printed circuit boards by massive parallel assembly

Micro-assembler

Micro-assembler

Systems and methods for forming micro-object assemblies

Digital imaging of marking materials by thermally induced pattern-wise transfer

System for forming a micro-assembler

Electrostatically addressable microvalves

Printing plate and system using heat-decomposable polymers

Digital printing plate and system with electrostatically latched deformable membranes

Patterned-print thin-film transistors with top gate geometry

Method of manufacturing fine features for thin film transistors

Contact spring application to semiconductor devices

Integrateable capacitors and microcoils and methods of making thereof

Integrateable capacitors and microcoils and methods of making thereof

Vapor induced self-assembly and electrode sealing

Vertically spaced plural microsprings