Carrollton, Texas
United States
23
2026-05-14
The entities that hold a legal rights for patent applications filed by inventor Kummerl Steven:
Steven Kummerl from Carrollton, US has applied for patents for these inventions. The list has both pending applications and granted patents:
POPULOUS CARRIER TAPE
#2 | 2025-02-06WIREBOND ELECTROPLATING STRUCTURE FOR FULL CUT WETTABLE FLANK STRUCTURES FOR SON PACKAGES
#3 | 2025-01-02OPTICAL FILTERING FOR SEMICONDUCTOR DEVICE PACKAGING
#4 | 2024-12-12LDMOS NANOSHEET TRANSISTOR
#5 | 2024-12-12CUSTOM LEADFRAME FROM STANDARD PLUS PRINTED LEADFRAME PORTION
#6 | 2021-03-25Floating die package
#7 | 2021-01-28Integrated circuit chip with a vertical connector
#8 | 2020-03-12Custom leadframe from standard plus printed leadframe portion
#9 | 2020-01-30Method for improving transistor performance
#10 | 2018-11-08THERMOELECTRIC DEVICE EMBEDDED IN A PRINTED CIRCUIT BOARD
#11 | 2017-11-16Floating die package
#12 | 2017-10-26Method for improving transistor performance
#13 | 2017-07-06Standoff connector for electrical devices
#14 | 2017-07-06Integrated circuit chip with a vertical connector
#15 | 2016-09-15TRANSFER MOLD COMPOUND MIXTURE FOR FABRICATING AN ELECTRONIC CIRCUIT
#16 | 2016-06-09Interposer with extruded feed-through vias
#17 | 2013-09-12Interposer with extruded feed-through vias
#18 | 2013-08-01THERMOELECTRIC DEVICE EMBEDDED IN A PRINTED CIRCUIT BOARD
#19 | 2013-06-20Method of fabricating an electronic circuit
#20 | 2012-08-09Integrated shunt resistor with external contact in a semiconductor package
#21 | 2011-02-10Manufacturing method for integrating a shunt resistor into a semiconductor package
#22 | 2010-01-07Manufacturing method for integrating a shunt resistor into a semiconductor package
#23 | 2008-04-24Leadframe and mold compound interlock in packaged semiconductor device
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