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Inventor profile of:

Hidehiro MAEDA

City:

Yokohama

Country:

Japan

Published Applications:

Last publication date:

2024-11-21

Top Assignees for applications by Hidehiro MAEDA

The entities that hold a legal rights for patent applications filed by inventor MAEDA Hidehiro:

NIKON CORPORATION 11 Tokyo, Japan
SCREEN Holdings, Co., Ltd. 1 Kyoto, Japan

Recent patent applications by MAEDA Hidehiro

Hidehiro MAEDA from Yokohama, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-11-21

US20240387177A1

Electricity

BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER

#2 | 2023-02-16

US20230052396A1

Electricity

CONTROL DEVICE, CONTROL METHOD, AND PROGRAM

#3 | 2022-03-17

US20220084870A1

Electricity

Substrate bonding apparatus and substrate bonding method

#4 | 2021-07-22

US20210225651A1

Electricity

Bonding method, bonding device, and holding member

#5 | 2019-08-29

US20190267238A1

Electricity

Bonding method, bonding device, and holding member

#6 | 2014-02-06

US20140036403A1

Electricity

Substrate holder, substrate holder unit, substrate transport apparatus, and substrate bonding apparatus

#7 | 2013-06-20

US20130157438A1

Electricity

Multi-layered substrate manufacturing method

#8 | 2012-12-27

US20120330459A1

Electricity

Transport method and transport apparatus

#9 | 2012-08-16

US20120205024A1

Electricity

Substrate holder system, substrate holder, fastening mechanism, substrate bonding apparatus and method for manufacturing devices

#10 | 2011-01-13

US20110007447A1

Electricity

Substrate holder, substrate holder unit, substrate transport apparatus, and substrate bonding apparatus

#11 | 2010-08-19

US20100206454A1

Electricity

Substrate bonding apparatus

InventorID:

2981206 ⎘