Hiroko SHINADA

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2023-03-02

Top Assignees for applications by Hiroko SHINADA

The entities that hold a legal rights for patent applications filed by inventor SHINADA Hiroko:

MITSUBISHI CHEMICAL CORPORATION 2 Tokyo, Japan
MITSUBISHI CHEMICAL CORPORATION 1 Chiyoda-ku, Japan

Recent patent applications by SHINADA Hiroko

Hiroko SHINADA from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2023-03-02

US20230063756A1

Chemistry; metallurgy

Polymer composition, lubricant additive, viscosity index improver, lubricant composition, method for producing polymer composition, and method for producing macromonomer

#2 | 2021-11-11

US20210347928A1

Chemistry; metallurgy

(Meth)acrylic Copolymer, Pressure-Sensitive Adhesive Composition, Pressure-Sensitive Adhesive, and Pressure-Sensitive Adhesive Sheet

#3 | 2019-09-12

US20190276717A1

Chemistry; metallurgy

Adhesive resin composition and adhesive sheet

InventorID:

2986740 ⎘