Somerville, Massachusetts
United States
22
2022-09-29
The entities that hold a legal rights for patent applications filed by inventor Hogan Patrick:
Patrick Hogan from Somerville, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Copper-alloy capping layers for metallization in touch-panel displays
#2 | 2022-04-28FABRICATION OF HIGH-ENTROPY ALLOY WIRE AND MULTI-PRINCIPAL ELEMENT ALLOY WIRE
#3 | 2022-01-27Microreactor systems and methods
#4 | 2021-11-18ADDITIVE MANUFACTURING UTILIZING METALLIC WIRE
#5 | 2021-07-08Copper-alloy capping layers for metallization in touch-panel displays
#6 | 2020-10-08Fabrication of high-entropy alloy wire and multi-principal element alloy wire
#7 | 2020-05-14Microreactor systems and methods
#8 | 2019-05-16Etch chemistries for metallization in electronic devices
#9 | 2019-01-31HIGH PURITY REFRACTORY METAL POWDERS AND THEIR USE IN SPUTTERING TARGETS WHICH MAY HAVE RANDOM TEXTURE
#10 | 2019-01-24Microreactor systems and methods
#11 | 2018-06-21Thin-film transistor and method of forming an electrode of a thin-film transistor
#12 | 2017-07-27Additive manufacturing utilizing metallic wire
#13 | 2017-07-27Fabrication of high-entropy alloy wire and multi-principal element alloy wire
#14 | 2016-12-22Etch chemistries for metallization in electronic devices
#15 | 2016-06-16COPPER-ALLOY BARRIER LAYERS FOR METALLIZATION IN THIN-FILM TRANSISTORS AND FLAT PANEL DISPLAYS
#16 | 2016-05-12Microreactor systems and methods
#17 | 2016-03-17SPRAY REJUVENATION OF SPUTTERING TARGETS
#18 | 2015-10-15High purity refractory metal powders and their use in sputtering targets which may have random texture
#19 | 2015-09-10Etch chemistries for metallization in electronic devices
#20 | 2014-12-11Copper-alloy barrier layers for metallization in thin-film transistors and flat panel displays
#21 | 2014-12-11Copper-alloy capping layers for metallization in touch-panel displays
#22 | 2013-06-20SPRAY REJUVENATION OF SPUTTERING TARGETS
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