Hsinchu
Taiwan
86
2025-05-15
The entities that hold a legal rights for patent applications filed by inventor Hung Jui-Pin:
Jui-Pin Hung from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
INTEGRATED CIRCUIT STRUCTURE
#2 | 2022-07-07Integrated circuit structure
#3 | 2022-05-26Integrated passive device package and methods of forming same
#4 | 2021-11-11Integrated circuit structure and method for reducing polymer layer delamination
#5 | 2021-09-09Semiconductor structure
#6 | 2021-07-15Chip on Package Structure and Method
#7 | 2020-12-03Structure and formation method for chip package
#8 | 2020-11-26Semiconductor package
#9 | 2020-11-05Integrated fan-out package structures with recesses in molding compound
#10 | 2020-10-01Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices
#11 | 2020-09-17Semiconductor package
#12 | 2020-08-13Method for manufacturing semiconductor package structure
#13 | 2020-07-30Semiconductor structure
#14 | 2020-05-07Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices
#15 | 2020-04-30Three-layer package-on-package structure and method forming same
#16 | 2020-03-19Integrated passive device package and methods of forming same
#17 | 2020-03-12Interconnect structure for package-on-package devices
#18 | 2020-02-06Manufacturing method of semiconductor package
#19 | 2019-11-14Integrated circuit structure
#20 | 2019-08-15Semiconductor package
#21 | 2019-08-15Interconnect structure for package-on-package devices
#22 | 2019-05-16Semiconductor structure and manufacturing method thereof
#23 | 2019-05-09Multi-chip package and method of formation
#24 | 2019-04-25Methods of packaging semiconductor devices including placing semiconductor devices into die caves
#25 | 2019-04-11Multi-chip fan out package and methods of forming the same
#26 | 2019-04-04Manufacturing method of semiconductor package
#27 | 2019-01-03Structure and formation method for chip package
#28 | 2018-12-27Chip on package structure and method
#29 | 2018-12-06Semiconductor package and manufacturing method of the same
#30 | 2018-12-06Integrated fan-out package structures with recesses in molding compound
#31 | 2018-12-06Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices
#32 | 2018-12-06Method of manufacturing a semiconductor device including through silicon plugs
#33 | 2018-11-15Semiconductor structure and manufacturing method thereof
#34 | 2018-10-11Semiconductor package structure
#35 | 2018-10-04Integrated fan-out structure with guiding trenches in buffer layer
#36 | 2018-09-20Semiconductor structure and manufacturing method thereof
#37 | 2018-09-20Semiconductor package device
#38 | 2018-08-30Semiconductor package
#39 | 2018-08-09Three-layer package-on-package structure and method forming same
#40 | 2018-07-26Interconnect structure for package-on-package devices
#41 | 2018-07-12Integrated passive device package and methods of forming same
#42 | 2018-02-01Semiconductor package structure
#43 | 2018-01-25Semiconductor package structure and manufacturing method thereof
#44 | 2017-12-28Semiconductor package and manufacturing method of the same
#45 | 2017-12-21Semiconductor package and manufacturing method of the same
#46 | 2017-11-30Semiconductor structure and manufacturing method thereof
#47 | 2017-10-26Chip on package structure and method
#48 | 2017-10-12Multi-chip fan out package and methods of forming the same
#49 | 2017-09-28Molding wafer chamber
#50 | 2017-09-21Package on package (PoP) bonding structures
#51 | 2017-09-21Methods of packaging semiconductor devices including placing semiconductor devices into die caves
#52 | 2017-08-10Integrated fan-out structure with guiding trenches in buffer layer
#53 | 2017-08-10Die package with openings surrounding end-portions of through package vias (TPVs) and package on package (PoP) using the die package
#54 | 2017-06-29Structure and formation method for chip package
#55 | 2017-06-15Integrated circuit structure and method for reducing polymer layer delamination
#56 | 2017-03-14Structure and formation method for chip package
#57 | 2017-01-12Semiconductor package device and manufacturing method thereof
#58 | 2016-11-17Method of forming a semiconductor package
#59 | 2016-09-15Semiconductor packaging structure and manufacturing method thereof
#60 | 2016-09-01Semiconductor structure and manufacturing method thereof
#61 | 2016-07-07Method of manufacturing a semiconductor device including through silicon plugs
#62 | 2016-04-28Package with metal-insulator-metal capacitor and method of manufacturing the same
#63 | 2015-07-02Method of packaging a semiconductor device
#64 | 2015-05-28NOVEL SEMICONDUCTOR PACKAGE WITH THROUGH SILICON VIAS
#65 | 2015-05-21Semiconductor device and manufacturing method thereof
#66 | 2015-04-23Semiconductor package device and manufacturing method thereof
#67 | 2015-04-16Fan out package, semiconductor device and manufacturing method thereof
#68 | 2015-01-15Method of forming a semiconductor package
#69 | 2015-01-08Semiconductor device and manufacturing method thereof
#70 | 2015-01-08Semiconductor device and manufacturing method thereof
#71 | 2014-08-14Package with metal-insulator-metal capacitor and method of manufacturing the same
#72 | 2014-07-17Wafer-level packaging mechanisms
#73 | 2014-03-06Three dimensional (3D) fan-out packaging mechanisms
#74 | 2013-11-21Wafer-level packaging mechanisms
#75 | 2013-11-14Method of manufacturing a semiconductor device including through silicon plugs
#76 | 2013-09-19Underfill curing method using carrier
#77 | 2013-07-04Packaged semiconductor device with a molding compound and a method of forming the same
#78 | 2013-06-20Chip on wafer bonder
#79 | 2013-05-16Package for three dimensional integrated circuit
#80 | 2011-10-06Heat dissipation by through silicon plugs
#81 | 2011-10-06Semiconductor package with through silicon vias
#82 | 2009-12-24Wafer's ambiance control
#83 | 2009-06-04Chip on wafer bonder
#84 | 2008-12-04Substrate carrier, port apparatus and facility interface and apparatus including same
#85 | 2008-12-04Apparatus for storing substrates
#86 | 2007-10-11Flash lamp annealing device
300053 ⎘