Kun-Ei CHEN

City:

Beimen Township

Country:

Taiwan

Published Applications:

Last publication date:

2013-12-05

Top Assignees for applications by Kun-Ei CHEN

The entities that hold a legal rights for patent applications filed by inventor CHEN Kun-Ei:

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 2 Hsin-Chu, Taiwan
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 1 Hsin-Chu, Taiwan

Recent patent applications by CHEN Kun-Ei

Kun-Ei CHEN from Beimen Township, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2013-12-05

US20130323859A1

Chemistry; metallurgy

System and method of monitoring and controlling atomic layer deposition of tungsten

#2 | 2013-09-26

US20130249039A1

Electricity

Metal shield structures in backside illumination image sensor chips

#3 | 2013-06-20

US20130157467A1

Electricity

Method for forming semiconductor device

InventorID:

300182 ⎘