Kenji Mimura

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2013-01-10

Top Assignees for applications by Kenji Mimura

The entities that hold a legal rights for patent applications filed by inventor Mimura Kenji:

Kenji Mimura from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Thermosetting resin composition, B-stage heat conductive sheet, and power module

Heat conductive sheet and method for producing same, and powder module

Semiconductor device and process for producing same

InventorID:

30333 ⎘