Jie CHEN

PACKAGES WITH MULTIPLE EXPOSED PADS

SMALL FORM FACTOR SEMICONDUCTOR PACKAGE WITH LOW ELECTROMIGRATION

LEADFRAME BASED SEMICONDUCTOR PACKAGE WITH MULTIPLE DEVICES

SEMICONDUCTOR PACKAGE WITH A CIRCUIT COMPONENT EMBEDDED IN A PACKAGING SUBSTRATE

ELECTRONIC DEVICE WITH INTEGRATED SHEILD AND HEAT SPREADER

MICROELECTRONIC DEVICE PACKAGE WITH INTEGRATED PASSIVE COMPONENT DIE AND SEMICONDUCTOR DEVICE DIE

PASSIVES TO FACILITATE MOLD COMPOUND FLOW

SEMICONDUCTOR PACKAGE WITH SHUNT AND PATTERNED METAL TRACE

WIDE BANDGAP POWER DEVICES WITH LOW POWER LOOP INDUCTANCE

WAFER-LEVEL FABRICATION OF ELECTROSTATIC DISCHARGE DEVICES

EMBEDDED INDUCTOR MODULE AND PACKAGED SEMICONDUCTOR DEVICE

THERMALLY ENHANCED PACKAGE WITH HIGH K MOLD COMPOUND ON DIE TOP

MULTILEVEL PACKAGE SUBSTRATE WITH BOX SHIELD

ELECTRONIC DEVICE PACKAGE EMI SHIELDING WITH GROUNDED MOLD INTERCONNECT

MICROELECTRONIC DEVICE PACKAGE INCLUDING INDUCTOR AND SEMICONDUCTOR DEVICE

Tunable Fingertip Capacitors with Enhanced Shielding in Ceramic Package

Hermetic Package Cooling Using Silver Tubes with Getter Absorption Material

PACKAGES WITH MULTIPLE EXPOSED PADS

FLIP CHIP PACKAGE FOR SEMICONDUCTOR DEVICES

Semiconductor package with electromagnetic interference shielding

Multi-channel gate driver package with grounded shield metal

Passives to facilitate mold compound flow

SEMICONDUCTOR DEVICE WITH A MULTILAYER PACKAGE SUBSTRATE

Semiconductor package with shunt and patterned metal trace

Semiconductor package with electromagnetic interference shielding

Interconnect Structure for High Power GaN Module

Packages with multiple exposed pads