Seiichi Uchimura

City:

Hyogo

Country:

Japan

Published Applications:

Last publication date:

2019-12-05

Top Assignees for applications by Seiichi Uchimura

The entities that hold a legal rights for patent applications filed by inventor Uchimura Seiichi:

Seiichi Uchimura from Hyogo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Solid-phase support comprising IgG-binding peptide, and method for separating IgG

InventorID:

3045119 ⎘