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Inventor profile of:

Daisuke OHNO

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2025-01-09

Top Assignees for applications by Daisuke OHNO

The entities that hold a legal rights for patent applications filed by inventor OHNO Daisuke:

Mitsubishi Gas Chemical Company, Inc. 21 Tokyo, Japan
JAPAN SCIENCE AND TECHNOLOGY CORPORATION 1 Saitama, Japan

Recent patent applications by OHNO Daisuke

Daisuke OHNO from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-01-09

US20250011294A1

Chemistry; metallurgy

METHOD FOR PRODUCING COMPOUND

#2 | 2022-03-31

US20220098369A1

Chemistry; metallurgy

DEGRADABLE RESIN COMPOSITION, DEGRADABLE CURED PRODUCT AND DOWNHOLE TOOL FOR DRILLING

#3 | 2019-12-19

US20190381463A1

Performing operations; transporting

Asymmetric membrane

#4 | 2012-12-27

US20120329957A1

Chemistry; metallurgy

AROMATIC DIAMINE COMPOUND AND AROMATIC DINITRO COMPOUND

#5 | 2010-02-25

US20100048826A1

Chemistry; metallurgy

Cyanate-terminated polyphenylene ether

#6 | 2009-12-17

US20090312519A1

Chemistry; metallurgy

Bismaleamic acid, bismaleimide and cured product thereof

#7 | 2009-11-19

US20090286094A1

Chemistry; metallurgy

Polyimide, polyamic acid and processes for the production thereof

#8 | 2009-08-20

US20090205856A1

Chemistry; metallurgy

Carboxylic acid-modified bisphenol epoxy di(meth)acrylate

#9 | 2009-03-19

US20090076307A1

Chemistry; metallurgy

Aromatic diamine compound and aromatic dinitro compound

#10 | 2008-12-04

US20080300350A1

Chemistry; metallurgy

Curable resin composition, curable film and their cured products

#11 | 2008-10-30

US20080269427A1

Chemistry; metallurgy

(Meth)acrylated epoxy-terminated polyphenylene ether

#12 | 2008-06-26

US20080154006A1

Chemistry; metallurgy

Carboxylic acid-modified biphenyl epoxy diacrylate

#13 | 2008-02-07

US20080033117A1

Chemistry; metallurgy

(Meth)acrylate-terminated polyphenylene ether

#14 | 2007-11-15

US20070265423A1

Chemistry; metallurgy

Di(meth)acrylate of epoxy-terminated polyphenylene ether

#15 | 2007-09-13

US20070213499A1

Chemistry; metallurgy

Polyfunctional phenylene ether oligomer, derivative thereof, resin composition containing the same, and use thereof

#16 | 2007-03-20

US10868799

Acid anhydride and polyimide using the same

#17 | 2006-07-04

US10747237

Curable resin composition and cured product thereof

#18 | 2006-04-20

US20060084787A1

Chemistry; metallurgy

Cyanate ester compound, flame-retardant resin composition, and cured product thereof

#19 | 2006-02-23

US20060041068A1

Chemistry; metallurgy

Curable resin composition, curable film and cured film

#20 | 2006-02-07

US10626569

Vinyl compound and cured product thereof

#21 | 2005-11-08

US10851290

Bifunctional phenylene ether oligomer, its derivatives, its use and process for the production thereof

#22 | 2005-09-27

US10182191

Polymeric micellar structure

#23 | 2005-08-25

US20050186430A1

Chemistry; metallurgy

Bifunctional phenylene ether oligomer, its derivatives, its use and process for the production thereof

#24 | 2005-08-18

US20050182203A1

Chemistry; metallurgy

Novel cyanate ester compound, flame-retardant resin composition, and cured product thereof

#25 | 2005-04-28

US20050090624A1

Chemistry; metallurgy

Process for the production of vinyl compound

#26 | 2005-03-24

US20050065241A1

Chemistry; metallurgy

Polyphenylene ether oligomer compound, derivatives thereof and use thereof

#27 | 2005-02-24

US20050042466A1

Chemistry; metallurgy

Resin composition and prepreg for laminate and metal-clad laminate

InventorID:

3054143 ⎘