Plano, Texas
United States
5
2025-06-19
The entities that hold a legal rights for patent applications filed by inventor Jain Manoj Kumar:
Manoj Kumar Jain from Plano, US has applied for patents for these inventions. The list has both pending applications and granted patents:
IC DEVICE WITH CHIP TO PACKAGE INTERCONNECTS FROM A COPPER METAL INTERCONNECT LEVEL
#2 | 2025-02-13SEMICONDUCTOR STRUCTURE AND METHOD FOR WAFER SCALE CHIP PACKAGE
#3 | 2022-06-16Fet construction with copper pillars or bump directly over the fet
#4 | 2021-12-02IC device with chip to package interconnects from a copper metal interconnect level
#5 | 2019-12-19Semiconductor structure and method for wafer scale chip package
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