Bernd Scheibe

City:

Dresden

Country:

Germany

Published Applications:

Last publication date:

2013-06-27

Recent patent applications by Scheibe Bernd

Bernd Scheibe from Dresden, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

MARKING OF A SUBSTRATE OF A SOLAR CELL

Method for manufacturing a flip-chip package, substrate for manufacturing and flip-chip assembly

Adhesion tape and method for mounting a chip onto a substrate

Manufacturing method for an electronic component assembly and corresponding electronic component assembly

Arrangement of a chip package constructed on a substrate and substrate for production of the same

Substrate-based package for integrated circuits

Method for producing an adhesive bond and adhesive bond between a chip and a planar surface

InventorID:

306075 ⎘