MIAOLI COUNTY
Taiwan
12
2012-05-17
The entities that hold a legal rights for patent applications filed by inventor CHEN JACK:
JACK CHEN from MIAOLI COUNTY, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
WHITE LIGHT-EMITTING DIODE PACKAGE STRUCTURE FOR SIMPLIFYING PACKAGE PROCESS AND METHOD FOR MAKING THE SAME
#2 | 2012-05-17LED PACKAGE STRUCTURE WITH A DEPOSITED-TYPE PHOSPHOR LAYER AND METHOD FOR MAKING THE SAME
#3 | 2012-05-03LED PACKAGE STRUCTURE
#4 | 2012-04-26Method for manufacturing a conductive substrate structure with conductive channels formed by using a two-sided cut approach
#5 | 2012-02-16LED PACKAGE STRUCTURE AND METHOD OF MAKING THE SAME
#6 | 2012-01-12WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASE LIGHT-EMITTING EFFICIENCY AND METHOD FOR MAKING THE SAME
#7 | 2011-12-15WAFER LEVEL DIODE PACKAGE STRUCTURE
#8 | 2011-06-30Conductive substrate structure with conductive channels formed by using a two-sided cut approach and a method for manufacturing the same
#9 | 2011-01-06SEMICONDUCTOR CHIP PACKAGE STRUCTURE FOR ACHIEVING FACE-UP ELECTRICAL CONNECTION WITHOUT USING A WIRE-BONDING PROCESS AND METHOD FOR MAKING THE SAME
#10 | 2009-11-19SEMICONDUCTOR CHIP PACKAGE STRUCTURE FOR ACHIEVING FACE-DOWN ELECTRICAL CONNECTION WITHOUT USING A WIRE-BONDING PROCESS AND METHOD FOR MAKING THE SAME
#11 | 2009-11-12SEMICONDUCTOR CHIP PACKAGE STRUCTURE WITHOUT SUBSTRATES FOR ACHIEVING FACE-UP ELECTRICAL CONNECTION WITHOUT USING A WIRE-BONDING PROCESS AND METHOD FOR MAKING THE SAME
#12 | 2009-09-17SEMICONDUCTOR CHIP PACKAGE STRUCTURE FOR ACHIEVING FACE-UP ELECTRICAL CONNECTION WITHOUT USING A WIRE-BONDING PROCESS AND METHOD FOR MAKING THE SAME
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