Olney, Maryland
United States
6
2012-01-19
The entities that hold a legal rights for patent applications filed by inventor Kilpatrick Stephen:
Stephen Kilpatrick from Olney, US has applied for patents for these inventions. The list has both pending applications and granted patents:
INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING REACTION BARRIER LAYERS
#2 | 2008-08-28Interconnections for flip-chip using lead-free solders and having reaction barrier layers
#3 | 2008-08-28Interconnections for flip-chip using lead-free solders and having reaction barrier layers
#4 | 2008-08-28INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING REACTION BARRIER LAYERS
#5 | 2005-10-13Interconnections for flip-chip using lead-free solders and having reaction barrier layers
#6 | 2005-05-19STABILIZING COPPER OVERLAYER FOR ENHANCED C4 INTERCONNECT RELIABILITY
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