Cheonan-si
South Korea
7
2012-01-19
The entities that hold a legal rights for patent applications filed by inventor HAN Jun-soo:
Jun-soo HAN from Cheonan-si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:
PACKAGE-ON-PACKAGE SEMICONDUCTOR PACKAGE HAVING SPACERS DISPOSED BETWEEN TWO PACKAGE SUBSTRATES
#2 | 2011-05-26WAFER POLISHING APPARATUS FOR ADJUSTING HEIGHT OF WHEEL TIP
#3 | 2011-02-03WIRING SUBSTRATE FOR A SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE HAVING THE WIRING SUBSTRATE
#4 | 2008-01-31Stack package using anisotropic conductive film (ACF) and method of making same
#5 | 2006-06-08Semiconductor package and manufacturing method thereof
#6 | 2006-05-18Stack package using anisotropic conductive film (ACF) and method of making same
#7 | 2005-12-29Semiconductor chip package manufacturing method including screen printing process
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