Hsinchu
Taiwan
50
2020-11-26
The entities that hold a legal rights for patent applications filed by inventor LIN HOU-TE:
HOU-TE LIN from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
LIGHT SOURCE DEVICE AND DISPLAY USING THE SAME
#2 | 2020-11-19PACKAGING STRUCTURE OF LIGHT EMITTING DIODE
#3 | 2020-10-15Optical lens, backlight module and display device using same
#4 | 2019-10-17Side-view light emitting diode package structure
#5 | 2017-10-19LED package
#6 | 2017-10-10Light emitting diode package substrate and light emitting diode package element
#7 | 2017-01-10LED package with reflecting cup
#8 | 2016-11-17Photoelectric device and method of manufacturing the same
#9 | 2016-08-30LED package with reflecting cup
#10 | 2016-04-28LED package with reflecting cup
#11 | 2016-04-14LED package and LED die
#12 | 2016-03-03Flip chip light emitting diode packaging structure
#13 | 2015-09-29Flip chip light emitting diode packaging structure
#14 | 2015-07-02Photoelectric device
#15 | 2015-06-25LED package
#16 | 2015-06-18Photoelectric device and method of manufacturing the same
#17 | 2015-02-26Light emitting diode package and method for manufacturing same
#18 | 2014-10-16METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGES
#19 | 2014-10-02Flip-chip light emitting diode package with moisture barrier layer
#20 | 2014-09-25Light emitting diode package
#21 | 2014-09-25Light emitting diode package
#22 | 2014-09-04Method for manufacturing light emitting diode packages
#23 | 2014-09-04METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGES
#24 | 2014-08-07Method for manufacturing light emitting diode package having a voltage stabilizing module consisting of two doping layers
#25 | 2014-08-07METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE
#26 | 2014-07-31Light emitting diode package with oxidation-resistant metal coating layer
#27 | 2014-06-26Light emitting diode package
#28 | 2014-05-01LIGHT EMITTING DIODE PACKAGE
#29 | 2014-03-06SIDE VIEW LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
#30 | 2014-01-02Method for manufacturing LED package
#31 | 2014-01-02Method for manufacturing LED package
#32 | 2014-01-02LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
#33 | 2013-12-26LED module
#34 | 2013-12-19Method for manufacturing light emitting diode package
#35 | 2013-10-31METHOD FOR MANUFACTURING SUPPORTING BOARDS OF LIGHT EMITTING DIODE MODULES
#36 | 2013-10-17LED module
#37 | 2013-09-05Backlight module having optcial fiber
#38 | 2013-07-04Light emitting diode assembly having a deformable lens
#39 | 2013-06-27Light emitting diode with sidewise light output structure and method for manufacturing the same
#40 | 2013-05-30LED and backlight module using the same
#41 | 2013-05-30LED package and light emitting device having the same
#42 | 2013-02-28LED package device
#43 | 2013-01-31Light emitting diode device
#44 | 2013-01-10Light emitting diode package having a voltage stabilizing module consisting of two doping layers
#45 | 2012-10-04LED package and method for manufacturing the same
#46 | 2012-09-06Light emitting diode device with lens having a cavity
#47 | 2012-08-23Light emitting diode package with reflective layer
#48 | 2012-06-28LED PACKAGE AND CHIP CARRIER THEREOF
#49 | 2012-06-21Light emitting diode package
#50 | 2012-05-31Light emitting diode package
307496 ⎘