Carrollton, Texas
United States
16
2012-04-12
The entities that hold a legal rights for patent applications filed by inventor KUMMERL Steven A.:
Steven A. KUMMERL from Carrollton, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Multi-component electronic system having leadframe with support-free with cantilever leads
#2 | 2012-01-19Semiconductor package with a mold material encapsulating a chip and a portion of a lead frame
#3 | 2011-01-20Leadframe having delamination resistant die pad
#4 | 2010-09-23Structure and method for sealing cavity of micro-electro-mechanical device
#5 | 2010-04-15Semiconductor package with a mold material encapsulating a chip and a portion of a lead frame
#6 | 2010-01-28Multi lead frame power package
#7 | 2008-04-24Die Infrared Transceiver Bus
#8 | 2008-01-24Multi Lead Frame Power Package
#9 | 2007-11-29Design and Method for Attaching a Die to a Leadframe in a Semiconductor Device
#10 | 2007-11-08Integrated circuit chip packaging assembly
#11 | 2007-08-09Bond capillary design for ribbon wire bonding
#12 | 2006-12-28Semiconductor device having firmly secured heat spreader
#13 | 2006-12-07Lead frame with attached components
#14 | 2006-06-22Package that integrates passive and active devices with or without a lead frame
#15 | 2006-06-22Multi lead frame power package
#16 | 2006-03-23Stacked die infrared transceiver bus
3076923 ⎘