Meridian, Idaho
United States
64
2013-06-27
The entities that hold a legal rights for patent applications filed by inventor Moore Scott E.:
Scott E. Moore from Meridian, US has applied for patents for these inventions. The list has both pending applications and granted patents:
RFID MATERIAL TRACKING METHOD AND APPARATUS
#2 | 2012-07-03Building frame construction tools and methods using laser alignment
#3 | 2012-02-28RFID material tracking method and apparatus
#4 | 2010-10-05RFID material tracking method and apparatus
#5 | 2009-05-26Turbidity monitoring methods, apparatuses, and sensors
#6 | 2009-05-12Semiconductor processor systems, a system configured to provide a semiconductor workpiece process fluid
#7 | 2007-12-27RFID material tracking method and apparatus
#8 | 2007-12-27RFID material tracking method and apparatus
#9 | 2007-11-13Method and apparatus for supporting a microelectronic substrate relative to a planarization pad
#10 | 2007-09-25Polishing apparatus
#11 | 2007-08-28Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
#12 | 2007-06-12Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
#13 | 2007-05-22Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate
#14 | 2007-05-17Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate
#15 | 2007-02-20Semiconductor processors, sensors, semiconductor processing systems, semiconductor workpiece processing methods, and turbidity monitoring methods
#16 | 2007-02-15Methods and apparatus for selectively removing conductive material from a microelectronic substrate
#17 | 2007-01-09Methods and apparatus for electrically and/or chemically-mechanically removing conductive material from a microelectronic substrate
#18 | 2006-12-26Methods and apparatus for selectively removing conductive material from a microelectronic substrate
#19 | 2006-12-26Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces
#20 | 2006-12-07Apparatus and method for conditioning polishing surface, and polishing apparatus and method of operation
#21 | 2006-12-05Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface
#22 | 2006-11-14Methods and apparatus for electrically detecting characteristics of a microelectronic substrate and/or polishing medium
#23 | 2006-11-09Methods and apparatus for electrically detecting characteristics of a microelectronic substrate and/or polishing medium
#24 | 2006-10-19Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate
#25 | 2006-10-10Semiconductor workpiece processing methods
#26 | 2006-10-10Semiconductor workpiece processing methods, a method of preparing semiconductor workpiece process fluid, and a method of delivering semiconductor workpiece process fluid to a semiconductor processor
#27 | 2006-10-10Semiconductor workpiece processing methods
#28 | 2006-09-28Methods and apparatus for removing conductive material from a microelectronic substrate
#29 | 2006-09-26Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate
#30 | 2006-08-31Methods and apparatus for removing conductive material from a microelectronic substrate
#31 | 2006-08-24Apparatus and method for conditioning polishing surface, and polishing apparatus and method of operation
#32 | 2006-08-22Microelectronic substrate having conductive material with blunt cornered apertures, and associated methods for removing conductive material
#33 | 2006-07-11Methods and apparatus for removing conductive material from a microelectronic substrate
#34 | 2006-07-06System and method for filling openings in semiconductor products
#35 | 2006-07-04System for filling openings in semiconductor products
#36 | 2006-06-20Method and apparatus for cleaning a web-based chemical mechanical planarization system
#37 | 2006-06-20Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface
#38 | 2006-06-08Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
#39 | 2006-06-01Method and apparatus for cleaning a web-based chemical mechanical planarization system
#40 | 2006-05-30RFID material tracking method and apparatus
#41 | 2006-05-09RFID material tracking method and apparatus
#42 | 2006-04-13Semiconductive substrate cleaning systems
#43 | 2006-02-21Methods of treating surfaces of substrates
#44 | 2006-02-21Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine
#45 | 2006-02-14Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface
#46 | 2006-01-05Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
#47 | 2005-11-29Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
#48 | 2005-10-18RFID material tracking method and apparatus
#49 | 2005-09-27Method and apparatus for cleaning a web-based chemical mechanical planarization system
#50 | 2005-09-20Method and apparatus for cleaning a web-based chemical mechanical planarization system
#51 | 2005-08-25Semiconductor processor control systems
#52 | 2005-07-26Planarizing machines and control systems for mechanical and/or chemical-mechanical planarization of microelectronic substrates
#53 | 2005-07-26Semiconductor die de-processing using a die holder and chemical mechanical polishing
#54 | 2005-07-14Methods of preparing semiconductor workpiece process fluid
#55 | 2005-07-05Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates
#56 | 2005-05-05Method of electroplating and varying the resistance of a wafer
#57 | 2005-03-17Methods and apparatus for removing conductive material from a microelectronic substrate
#58 | 2005-03-17Methods and apparatus for removing conductive material from a microelectronic substrate
#59 | 2005-03-03System and method for filling openings in semiconductor products
#60 | 2005-02-22Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
#61 | 2005-02-17Methods and apparatus for electrically and/or chemically-mechanically removing conductive material from a microelectronic substrate
#62 | 2005-02-17Methods and apparatus for electrically and/or chemically-mechanically removing conductive material from a microelectronic substrate
#63 | 2005-02-03Semiconductor processor control systems, semiconductor processor systems, and systems configured to provide a semiconductor workpiece process fluid
#64 | 2005-01-11Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
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