Boise, Idaho
United States
13
2012-02-02
The entities that hold a legal rights for patent applications filed by inventor Tandy Patrick W.:
Patrick W. Tandy from Boise, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Methods of operating electronic devices, and methods of providing electronic devices
#2 | 2011-05-31Solder ball landpad design to improve laminate performance
#3 | 2010-12-23Methods of operating electronic devices, and methods of providing electronic devices
#4 | 2007-12-27Methods of operating electronic devices, and methods of providing electronic devices
#5 | 2007-06-14METHOD OF FORMING A NON-CONTINUOUS CONDUCTIVE LAYER FOR LAMINATED SUBSTRATES
#6 | 2007-05-15Method of forming a non-continuous conductive layer for laminated substrates
#7 | 2006-12-28Methods of operating electronic devices, and methods of providing electronic devices
#8 | 2006-09-12Methods of operating microelectronic devices, and methods of providing microelectronic devices
#9 | 2006-06-08Mold assembly, method and a package stack via bottom-leaded plastic (BLP) packaging
#10 | 2006-02-14Selectively coating bond pads
#11 | 2006-02-09Selectively coating bond pads
#12 | 2005-11-03Mold assembly for a package stack via bottom-leaded plastic (BLP) packaging
#13 | 2005-05-31Mold assembly for a package stack via bottom-leaded plastic (blp) packaging
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