Hiroki Terazaki

City:

Tsukuba

Country:

Japan

Published Applications:

Last publication date:

2012-03-01

Top Assignees for applications by Hiroki Terazaki

The entities that hold a legal rights for patent applications filed by inventor Terazaki Hiroki:

HITACHI CHEMICAL COMPANY, LTD. 9 Tokyo, Japan
HITACHI, LTD. 8 Tokyo, Japan
HITACHI CHEMICAL CO., LTD. 1 Tokyo, Japan

Recent patent applications by Terazaki Hiroki

Hiroki Terazaki from Tsukuba, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2012-03-01

US20120048830A1

Chemistry; metallurgy

Abrasive liquid for metal and method for polishing

#2 | 2008-05-29

US20080121840A1

Chemistry; metallurgy

Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same

#3 | 2007-07-31

US9869347

Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same

#4 | 2007-07-19

US20070167017A1

Chemistry; metallurgy

Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same

#5 | 2006-09-28

US20060216939A1

Chemistry; metallurgy

Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same

#6 | 2005-05-31

US9976001

Abrasive liquid for metal and method for polishing

#7 | 2005-05-24

US9763891

Abrasive liquid for metal and method for polishing

#8 | 2005-05-05

US20050095860A1

Chemistry; metallurgy

Abrasive liquid for metal and method for polishing

#9 | 2005-04-21

US20050085168A1

Chemistry; metallurgy

Cerium oxide abrasive and method of polishing substrates

#10 | 2005-03-08

US9782241

Cerium oxide abrasive and method of polishing substrates

InventorID:

3107706 ⎘