Michael Linder

City:

Neuchatel

Country:

Switzerland

Published Applications:

Last publication date:

2012-07-19

Top Assignees for applications by Michael Linder

The entities that hold a legal rights for patent applications filed by inventor Linder Michael:

Michael Linder from Neuchatel, CH has applied for patents for these inventions. The list has both pending applications and granted patents:

METHOD OF CUTTING A SUBSTRATE AND A DEVICE FOR CUTTING

Method of smoothing and/or bevelling an edge of a substrate

InventorID:

3113552 ⎘