Paul Morganelli

City:

Upton, Massachusetts

Country:

United States

Published Applications:

Last publication date:

2012-03-15

Top Assignees for applications by Paul Morganelli

The entities that hold a legal rights for patent applications filed by inventor Morganelli Paul:

Paul Morganelli from Upton, US has applied for patents for these inventions. The list has both pending applications and granted patents:

WATERBORNE CONDUCTIVE COMPOSITIONS

Low viscosity curable compositions

Foamable underfill encapsulant

Method of using pre-applied underfill encapsulant

Method for pre-applied thermoplastic reinforcement of electronic components

Method of using pre-applied underfill encapsulant

InventorID:

3118720 ⎘